Signal Integrity and Power Loss Analysis for Different Bump Structures in Cylindrical TSV - researchr publication authors

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Shivangi Chandrakar, Kunal Kranti Das, Deepika Gupta, Manoj Kumar Majumder. Signal Integrity and Power Loss Analysis for Different Bump Structures in Cylindrical TSV. In Ambika Prasad Shah, Sudeb Dasgupta, Anand D. Darji, Jaynarayan T. Tudu, editors, VLSI Design and Test - 26th International Symposium, VDAT 2022, Jammu, India, July 17-19, 2022, Revised Selected Papers. Volume 1687 of Communications in Computer and Information Science, pages 358-372, Springer, 2022. [doi]

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