Detecting Multiclass Defects of Printed Circuit Boards in the Molded-interconnect-device Manufacturing Process Using Deep Object Detection Networks - researchr publication authors

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Chun-hsiang Chang, Hao-Wei Chen, Chun-Cheng Lin. Detecting Multiclass Defects of Printed Circuit Boards in the Molded-interconnect-device Manufacturing Process Using Deep Object Detection Networks. In IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2022, Kuala Lumpur, Malaysia, December 7-10, 2022. pages 1536-1540, IEEE, 2022. [doi]

This author has not been identified. Look up 'Chun-hsiang Chang' in GoogleThis author has not been identified. Look up 'Hao-Wei Chen' in GoogleThis author has not been identified. Look up 'Chun-Cheng Lin' in Google

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