Chun-hsiang Chang, Hao-Wei Chen, Chun-Cheng Lin. Detecting Multiclass Defects of Printed Circuit Boards in the Molded-interconnect-device Manufacturing Process Using Deep Object Detection Networks. In IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2022, Kuala Lumpur, Malaysia, December 7-10, 2022. pages 1536-1540, IEEE, 2022. [doi]
Abstract is missing.