Chuan-Yu Chang, Yung-Chi Chang, ChunHsi Li, MuDer Jeng. Automatic Die Inspection for Post-sawing LED Wafers. In Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, San Antonio, TX, USA, 11-14 October 2009. pages 1615-1620, IEEE, 2009. [doi]
@inproceedings{ChangCLJ09,
title = {Automatic Die Inspection for Post-sawing LED Wafers},
author = {Chuan-Yu Chang and Yung-Chi Chang and ChunHsi Li and MuDer Jeng},
year = {2009},
doi = {10.1109/ICSMC.2009.5346751},
url = {http://dx.doi.org/10.1109/ICSMC.2009.5346751},
researchr = {https://researchr.org/publication/ChangCLJ09},
cites = {0},
citedby = {0},
pages = {1615-1620},
booktitle = {Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, San Antonio, TX, USA, 11-14 October 2009},
publisher = {IEEE},
}