ILP-based inter-die routing for 3D ICs

Chia-Jen Chang, Pao-Jen Huang, Tai-Chen Chen, Chien-Nan Jimmy Liu. ILP-based inter-die routing for 3D ICs. In Proceedings of the 16th Asia South Pacific Design Automation Conference, ASP-DAC 2011, Yokohama, Japan, January 25-27, 2011. pages 330-335, IEEE, 2011. [doi]

Abstract

Abstract is missing.