Xinyue Chang, Zhiyu Jin, Yun-Na Sun, Yan Wang, Zhuoqing Yang, Guifu Ding. An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 32-35, IEEE, 2018. [doi]
Abstract is missing.