Next generation of Deep Trench Isolation for Smart Power technologies with 120 V high-voltage devices

R. Charavel, J. Roig, S. Mouhoubi, P. Gassot, F. Bauwens, P. Vanmeerbeek, B. Desoete, P. Moens, Eddy De Backer. Next generation of Deep Trench Isolation for Smart Power technologies with 120 V high-voltage devices. Microelectronics Reliability, 50(9-11):1758-1762, 2010. [doi]

@article{CharavelRMGBVDMB10,
  title = {Next generation of Deep Trench Isolation for Smart Power technologies with 120 V high-voltage devices},
  author = {R. Charavel and J. Roig and S. Mouhoubi and P. Gassot and F. Bauwens and P. Vanmeerbeek and B. Desoete and P. Moens and Eddy De Backer},
  year = {2010},
  doi = {10.1016/j.microrel.2010.07.117},
  url = {http://dx.doi.org/10.1016/j.microrel.2010.07.117},
  researchr = {https://researchr.org/publication/CharavelRMGBVDMB10},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {50},
  number = {9-11},
  pages = {1758-1762},
}