Debika Chaudhuri, Dalia Nandi Das, Hafizur Rahaman 0001, Tamal Ghosh. Heat Mitigation in 3D ICs by Improvised TTSV Structure. In 3rd International Symposium on Devices, Circuits and Systems, ISDCS 2020, Howrah, India, March 4-6, 2020. pages 1-4, IEEE, 2020. [doi]
Abstract is missing.