Study on reliability of PQFP assembly with lead free solder joints under random vibration test

F. X. Che, John H. L. Pang. Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectronics Reliability, 55(12):2769-2776, 2015. [doi]

Authors

F. X. Che

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John H. L. Pang

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