F. X. Che, John H. L. Pang. Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectronics Reliability, 55(12):2769-2776, 2015. [doi]
@article{CheP15-0,
title = {Study on reliability of PQFP assembly with lead free solder joints under random vibration test},
author = {F. X. Che and John H. L. Pang},
year = {2015},
doi = {10.1016/j.microrel.2015.09.010},
url = {http://dx.doi.org/10.1016/j.microrel.2015.09.010},
researchr = {https://researchr.org/publication/CheP15-0},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {12},
pages = {2769-2776},
}