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Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin. Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectronics Reliability, 61:64-70, 2016. [doi]

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Fa Xing Che

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Xiaowu Zhang

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Jong-Kai Lin

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