Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin. Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectronics Reliability, 61:64-70, 2016. [doi]
@article{CheZL16,
title = {Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis},
author = {Fa Xing Che and Xiaowu Zhang and Jong-Kai Lin},
year = {2016},
doi = {10.1016/j.microrel.2015.12.041},
url = {http://dx.doi.org/10.1016/j.microrel.2015.12.041},
researchr = {https://researchr.org/publication/CheZL16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {61},
pages = {64-70},
}