Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design

Gengjie Chen, Jian Kuang 0001, Zhiliang Zeng, Hang Zhang, Evangeline F. Y. Young, Bei Yu. Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design. In Proceedings of the 54th Annual Design Automation Conference, DAC 2017, Austin, TX, USA, June 18-22, 2017. ACM, 2017. [doi]

@inproceedings{Chen0ZZYY17,
  title = {Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design},
  author = {Gengjie Chen and Jian Kuang 0001 and Zhiliang Zeng and Hang Zhang and Evangeline F. Y. Young and Bei Yu},
  year = {2017},
  doi = {10.1145/3061639.3062285},
  url = {http://doi.acm.org/10.1145/3061639.3062285},
  researchr = {https://researchr.org/publication/Chen0ZZYY17},
  cites = {0},
  citedby = {0},
  booktitle = {Proceedings of the 54th Annual Design Automation Conference, DAC 2017, Austin, TX, USA, June 18-22, 2017},
  publisher = {ACM},
  isbn = {978-1-4503-4927-7},
}