Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies

F. Chen, O. Bravo, D. Harmon, M. Shinosky, J. Aitken. Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies. Microelectronics Reliability, 48(8-9):1375-1383, 2008. [doi]

Abstract

Abstract is missing.