A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes

Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-yao Chang, Mingliang Tan, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs. A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes. In 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018, San Francisco, CA, USA, February 11-15, 2018. pages 186-188, IEEE, 2018. [doi]

@inproceedings{ChenCBNCTVBVJP18,
  title = {A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes},
  author = {Chao Chen and Zhao Chen and Deep Bera and Emile Noothout and Zu-yao Chang and Mingliang Tan and Hendrik J. Vos and Johan G. Bosch and Martin D. Verweij and Nico de Jong and Michiel A. P. Pertijs},
  year = {2018},
  doi = {10.1109/ISSCC.2018.8310246},
  url = {https://doi.org/10.1109/ISSCC.2018.8310246},
  researchr = {https://researchr.org/publication/ChenCBNCTVBVJP18},
  cites = {0},
  citedby = {0},
  pages = {186-188},
  booktitle = {2018 IEEE International Solid-State Circuits Conference, ISSCC 2018, San Francisco, CA, USA, February 11-15, 2018},
  publisher = {IEEE},
  isbn = {978-1-5090-4940-0},
}