Ming-Che Chen, Wan-Jung Chang, Zhen-Hao Chen, Chia-Hao Hsu, Yi-Chan Chiu, Jian-Ping Su, Tsung-Sheng Cheng. A PCBA Solder Joint Defects Inspection System Based on Deep Learning Technology. In IEEE International Conference on Consumer Electronics, ICCE 2023, Las Vegas, NV, USA, January 6-8, 2023. pages 1-3, IEEE, 2023. [doi]
Abstract is missing.