DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module

Xiliang Chen, Wenjie Chen, Yu Ren, Xu Yang 0012, Liang Qiao. DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module. IEEE Trans. Circuits Syst. II Express Briefs, 68(6):2077-2081, 2021. [doi]

Abstract

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