Thermal resistance analysis and validation of flip chip PBGA packages

Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang. Thermal resistance analysis and validation of flip chip PBGA packages. Microelectronics Reliability, 46(2-4):440-448, 2006. [doi]

Authors

Kuo-Ming Chen

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Kuo-Hsiung Houng

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Kuo-Ning Chiang

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