Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang. Thermal resistance analysis and validation of flip chip PBGA packages. Microelectronics Reliability, 46(2-4):440-448, 2006. [doi]
@article{ChenHC06,
title = {Thermal resistance analysis and validation of flip chip PBGA packages},
author = {Kuo-Ming Chen and Kuo-Hsiung Houng and Kuo-Ning Chiang},
year = {2006},
doi = {10.1016/j.microrel.2005.06.001},
url = {http://dx.doi.org/10.1016/j.microrel.2005.06.001},
tags = {analysis},
researchr = {https://researchr.org/publication/ChenHC06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {2-4},
pages = {440-448},
}