Hongtao Chen, Jing Han, Jue Li, Mingyu Li. Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing. Microelectronics Reliability, 52(6):1112-1120, 2012. [doi]
@article{ChenHLL12-1,
title = {Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing},
author = {Hongtao Chen and Jing Han and Jue Li and Mingyu Li},
year = {2012},
doi = {10.1016/j.microrel.2012.01.009},
url = {http://dx.doi.org/10.1016/j.microrel.2012.01.009},
researchr = {https://researchr.org/publication/ChenHLL12-1},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {6},
pages = {1112-1120},
}