Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.
Sign up for an account to create a profile with publication list, tag and review your related work, and share bibliographies with your co-authors.
Hongtao Chen, Jing Han, Jue Li, Mingyu Li. Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing. Microelectronics Reliability, 52(6):1112-1120, 2012. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock testsTomi Laurila, Toni T. Mattila, V. Vuorinen, J. Karppinen, Jue Li, M. Sippola, Jorma K. Kivilahti. mr, 47(7):1135-1144, 2007. [doi]
The following publications are possibly variants of this publication: