Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs)

Qianwen Chen, Cui Huang, Zheyao Wang. Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs). Microelectronics Reliability, 52(11):2670-2676, 2012. [doi]

Authors

Qianwen Chen

This author has not been identified. Look up 'Qianwen Chen' in Google

Cui Huang

This author has not been identified. Look up 'Cui Huang' in Google

Zheyao Wang

This author has not been identified. Look up 'Zheyao Wang' in Google