Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs)

Qianwen Chen, Cui Huang, Zheyao Wang. Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs). Microelectronics Reliability, 52(11):2670-2676, 2012. [doi]

Abstract

Abstract is missing.