Shouhong Chen, Huaiqiang Kang, Jun Ma, Ling Guo, Xingna Hou. Research on TSV Void Defects Based on Machine Learning. In Ali Emrouznejad, Zeshui Xu, editors, Proceedings of the 3rd International Conference on Computer Science and Application Engineering, CSAE 2019, Sanya, China, October 22-24, 2019. ACM, 2019. [doi]
Abstract is missing.