Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package

Ying Chen, Jun Li, Fei Ding, Liqiang Cao. Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package. IEICE Electronic Express, 19(14):20220122, 2022. [doi]

Authors

Ying Chen

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Jun Li

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Fei Ding

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Liqiang Cao

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