Liang Chen 0025, Jincong Lu, Wentian Jin, Sheldon X.-D. Tan. Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks. In IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023. pages 1-8, IEEE, 2023. [doi]
@inproceedings{ChenLJT23,
title = {Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks},
author = {Liang Chen 0025 and Jincong Lu and Wentian Jin and Sheldon X.-D. Tan},
year = {2023},
doi = {10.1109/ICCAD57390.2023.10323696},
url = {https://doi.org/10.1109/ICCAD57390.2023.10323696},
researchr = {https://researchr.org/publication/ChenLJT23},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2225-5},
}