HsinChen Chen, Rolf Lagerquist, Ashish Nayak, Hugh Mair, Gokulakrishnan Manoharan, Ericbill Wang, Gordon Gammie, Efron Ho, Anand Rajagopalan, Lee-Kee Yong, Ramu Madhavaram, Madhur Jagota, Chi-Jui Chung, Sudhakar Maruthi, Jenny Wiedemeier, Tao Chen, Henry Hsieh, Daniel Dia, Amjad Sikiligiri, Manzur Rahman, Barry Chen, Curtis Lin, Vincent Lin, Elly Chiang, Cheng-Yuh Wu, Po-Yang Hsu, Jason Tsai, Wade Wu, Achuta Thippana, S. A. Huang. A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem. In IEEE International Solid-State Circuits Conference, ISSCC 2021, San Francisco, CA, USA, February 13-22, 2021. pages 54-56, IEEE, 2021. [doi]
@inproceedings{ChenLNMMWGHRYMJ21,
title = {A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem},
author = {HsinChen Chen and Rolf Lagerquist and Ashish Nayak and Hugh Mair and Gokulakrishnan Manoharan and Ericbill Wang and Gordon Gammie and Efron Ho and Anand Rajagopalan and Lee-Kee Yong and Ramu Madhavaram and Madhur Jagota and Chi-Jui Chung and Sudhakar Maruthi and Jenny Wiedemeier and Tao Chen and Henry Hsieh and Daniel Dia and Amjad Sikiligiri and Manzur Rahman and Barry Chen and Curtis Lin and Vincent Lin and Elly Chiang and Cheng-Yuh Wu and Po-Yang Hsu and Jason Tsai and Wade Wu and Achuta Thippana and S. A. Huang},
year = {2021},
doi = {10.1109/ISSCC42613.2021.9365774},
url = {https://doi.org/10.1109/ISSCC42613.2021.9365774},
researchr = {https://researchr.org/publication/ChenLNMMWGHRYMJ21},
cites = {0},
citedby = {0},
pages = {54-56},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2021, San Francisco, CA, USA, February 13-22, 2021},
publisher = {IEEE},
isbn = {978-1-7281-9549-0},
}