3D-HIM: A 3D High-density Interleaved Memory for bipolar RRAM design - researchr publication authors

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Yi-Chung Chen, Hai Li, Wei Zhang, Robinson E. Pino. 3D-HIM: A 3D High-density Interleaved Memory for bipolar RRAM design. In Proceedings of the 2011 IEEE/ACM International Symposium on Nanoscale Architectures, NANOARCH 2011, San Diego, CA, USA, June 8-9, 2011. pages 59-64, IEEE Computer Society, 2011. [doi]

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