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Protrusion of electroplated copper filled in through silicon vias during annealing process

Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi. Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectronics Reliability, 63:183-193, 2016. [doi]

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Si Chen

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Fei Qin

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Tong An

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Pei Chen

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Bin Xie

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Xunqing Shi

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