Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi. Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectronics Reliability, 63:183-193, 2016. [doi]
@article{ChenQACXS16,
title = {Protrusion of electroplated copper filled in through silicon vias during annealing process},
author = {Si Chen and Fei Qin and Tong An and Pei Chen and Bin Xie and Xunqing Shi},
year = {2016},
doi = {10.1016/j.microrel.2016.04.005},
url = {http://dx.doi.org/10.1016/j.microrel.2016.04.005},
researchr = {https://researchr.org/publication/ChenQACXS16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {63},
pages = {183-193},
}