Kun-Chih Chen, Hsueh-Wen Tang. A Low-Complex Compressive Sensing Based Thermal Sensor Placement for Multicore Systems. In 17th IEEE International New Circuits and Systems Conference, NEWCAS 2019, Munich, Germany, June 23-26, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{ChenT19-21, title = {A Low-Complex Compressive Sensing Based Thermal Sensor Placement for Multicore Systems}, author = {Kun-Chih Chen and Hsueh-Wen Tang}, year = {2019}, doi = {10.1109/NEWCAS44328.2019.8961281}, url = {https://doi.org/10.1109/NEWCAS44328.2019.8961281}, researchr = {https://researchr.org/publication/ChenT19-21}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {17th IEEE International New Circuits and Systems Conference, NEWCAS 2019, Munich, Germany, June 23-26, 2019}, publisher = {IEEE}, isbn = {978-1-7281-1031-8}, }