Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An. The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectronics Reliability, 91:52-66, 2018. [doi]
@article{ChenWEHQA18,
title = {The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface},
author = {Si Chen and Zhizhe Wang and Yunfei En and Yun Huang and Fei Qin and Tong An},
year = {2018},
doi = {10.1016/j.microrel.2018.08.005},
url = {https://doi.org/10.1016/j.microrel.2018.08.005},
researchr = {https://researchr.org/publication/ChenWEHQA18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {91},
pages = {52-66},
}