Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu. IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. Microelectronics Reliability, 53(1):30-40, 2013. [doi]
@article{ChenYCTL13,
title = {IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging},
author = {Wen-Hwa Chen and Ching-Feng Yu and Hsien-Chie Cheng and Yu-min Tsai and Su-Tsai Lu},
year = {2013},
doi = {10.1016/j.microrel.2012.06.146},
url = {http://dx.doi.org/10.1016/j.microrel.2012.06.146},
researchr = {https://researchr.org/publication/ChenYCTL13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {1},
pages = {30-40},
}