IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu. IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. Microelectronics Reliability, 53(1):30-40, 2013. [doi]

Abstract

Abstract is missing.