A Quantity Evaluation and Reconfiguration Mechanism for Signal- and Power-Interconnections in 3D-Stacking System

Ching-Hwa Cheng. A Quantity Evaluation and Reconfiguration Mechanism for Signal- and Power-Interconnections in 3D-Stacking System. In 25th Asia and South Pacific Design Automation Conference, ASP-DAC 2020, Beijing, China, January 13-16, 2020. pages 7-8, IEEE, 2020. [doi]

@inproceedings{Cheng20-6,
  title = {A Quantity Evaluation and Reconfiguration Mechanism for Signal- and Power-Interconnections in 3D-Stacking System},
  author = {Ching-Hwa Cheng},
  year = {2020},
  doi = {10.1109/ASP-DAC47756.2020.9045169},
  url = {https://doi.org/10.1109/ASP-DAC47756.2020.9045169},
  researchr = {https://researchr.org/publication/Cheng20-6},
  cites = {0},
  citedby = {0},
  pages = {7-8},
  booktitle = {25th Asia and South Pacific Design Automation Conference, ASP-DAC 2020, Beijing, China, January 13-16, 2020},
  publisher = {IEEE},
  isbn = {978-1-7281-4123-7},
}