Ben Cheng, Chetan Arora 0002, Xiao Liu 0004, Thuong Hoang, Yi Wang, John C. Grundy. Multi-Modal Emotion Recognition for Enhanced Requirements Engineering: A Novel Approach. In Kurt Schneider, Fabiano Dalpiaz, Jennifer Horkoff, editors, 31st IEEE International Requirements Engineering Conference, RE 2023, Hannover, Germany, September 4-8, 2023. pages 299-304, IEEE, 2023. [doi]
Abstract is missing.