Handling of multi-reflections in wafer bump 3D reconstruction - researchr publication authors

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Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung. Handling of multi-reflections in wafer bump 3D reconstruction. In Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, Singapore, 12-15 October 2008. pages 1558-1561, IEEE, 2008. [doi]

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