Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung. Handling of multi-reflections in wafer bump 3D reconstruction. In Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, Singapore, 12-15 October 2008. pages 1558-1561, IEEE, 2008. [doi]
@inproceedings{ChengCLF08,
title = {Handling of multi-reflections in wafer bump 3D reconstruction},
author = {Jun Cheng and Ronald Chung and Edmund Y. Lam and Kenneth S. M. Fung},
year = {2008},
doi = {10.1109/ICSMC.2008.4811508},
url = {http://dx.doi.org/10.1109/ICSMC.2008.4811508},
researchr = {https://researchr.org/publication/ChengCLF08},
cites = {0},
citedby = {0},
pages = {1558-1561},
booktitle = {Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, Singapore, 12-15 October 2008},
publisher = {IEEE},
isbn = {978-1-4244-2383-5},
}