The following publications are possibly variants of this publication:
- Fine grain thermal modeling of 3D stacked structuresOprins, H., Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Adi Srinivasan, Cheng, E.. Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, :45-49, 2009.