Adi Srinivasan - researchr profile publications

researchr

You are not signed in
Sign in
Sign up

Viewing Publication 1 - 9 from 9

2011

Fine grain thermal modeling and experimental validation of 3D-ICsOprins, H., Adi Srinivasan, Cupak, M., Cherman, V., Torregiani, C., Stucchi, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. mj, 42(4):572-578, April 2011. [doi]

2010

Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICsMelamed, Samson, Thorolfsson, Thorlindur, Adi Srinivasan, Cheng, Edmund, Franzon, Paul, Davis, W. Rhett. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-6, 2010.

Experimental characterization and model validation of thermal hot spots in 3D stacked ICsOprins, H., Cherman, V., Adi Srinivasan, Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-5, 2010.

2009

Junction-level thermal extraction and simulation of 3DICsSamson Melamed, Thorlindur Thorolfsson, Adi Srinivasan, Edmund Cheng, Paul Franzon, Rhett Davis. 3dic 2009: 1-7 [doi]

Fine grain thermal modeling of 3D stacked structuresOprins, H., Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Adi Srinivasan, Cheng, E.. Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, :45-49, 2009.

2008

Practical chip-centric electro-thermal simulationsGillon, Renaud, Joris, Patricia, Oprins, Herman, Vandevelde, Bart, Adi Srinivasan, Chandra, Rajit. 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems, (September):220-223, sep 2008. [doi]

1996

Non-orthogonal decoding: An architectural element for reprogrammable interconnect or logicAdi Srinivasan. IEEE Proceedings of Custom Integrated Circuits Conference, 1996. [doi]

1994

A novel reprogrammable interconnect architecture with decoded RAM storageGuo, R., Nguyen, H., Adi Srinivasan, Nasir, Q., Cai, H., Law, S., Mohsen, A.. IEEE Proceedings of Custom Integrated Circuits Conference, 1994. [doi]

1992

A 1024 Pin Universal Interconnect Array With Routing ArchitectureGuo, R., Adi Srinivasan, Verheyen, H., Law, S., Mohsen, A.. IEEE Proceedings of Custom Integrated Circuits Conference, 1992. [doi]

Sign in or sign up to see more results.

runs on WebDSL