Wei Cheng, Yugang Yin, Yipan Li, Haoer Zhang, Shiming Zhang, Lingyun Wang, Daoheng Sun. Discussion on the lapping and polishing process of 4H-SiC wafer. In 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013. pages 841-844, IEEE, 2013. [doi]
Abstract is missing.