Towards high density 3D interconnections - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Séverine Cheramy, Amadine Jouve, L. Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet. Towards high density 3D interconnections. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-5, IEEE, 2016. [doi]

This author has not been identified. Look up 'Séverine Cheramy' in GoogleThis author has not been identified. Look up 'Amadine Jouve' in GoogleThis author has not been identified. Look up 'L. Arnaud' in GoogleThis author has not been identified. Look up 'Claire Fenouillet-Béranger' in GoogleThis author has not been identified. Look up 'Perrine Batude' in GoogleThis author has not been identified. Look up 'Maud Vinet' in Google

runs on WebDSL