Weng C. Chew. Multi-scale, multi-physics analysis for device, chip, package, and board level. In 2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012. pages 497, IEEE, 2012. [doi]
@inproceedings{Chew12,
title = {Multi-scale, multi-physics analysis for device, chip, package, and board level},
author = {Weng C. Chew},
year = {2012},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=6386713},
researchr = {https://researchr.org/publication/Chew12},
cites = {0},
citedby = {0},
pages = {497},
booktitle = {2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012},
publisher = {IEEE},
}