Jason Chew, Uday Mahajan, Rajeev Bajaj, Iad Mirshad, Robert Newcomb. Characterization and optimization of a TSV CMP reveal process using a novel wafer inspection technique for detecting sub-monolayer surface contamination. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
@inproceedings{ChewMBMN13a,
title = {Characterization and optimization of a TSV CMP reveal process using a novel wafer inspection technique for detecting sub-monolayer surface contamination},
author = {Jason Chew and Uday Mahajan and Rajeev Bajaj and Iad Mirshad and Robert Newcomb},
year = {2013},
doi = {10.1109/3DIC.2013.6702372},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702372},
researchr = {https://researchr.org/publication/ChewMBMN13a},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}