Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base - researchr publication authors

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Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu. Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base. In Proceedings of the 20th IEEE Asian Test Symposium, ATS 2011, New Delhi, India, November 20-23, 2011. pages 451-456, IEEE Computer Society, 2011. [doi]

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