Performance and process characteristic of glass interposer with through-glass-via(TGV) - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu. Performance and process characteristic of glass interposer with through-glass-via(TGV). In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-7, IEEE, 2013. [doi]

This author has not been identified. Look up 'Chun-Hsien Chien' in GoogleThis author has not been identified. Look up 'Hsun Yu' in GoogleThis author has not been identified. Look up 'Ching-Kuan Lee' in GoogleThis author has not been identified. Look up 'Yu-Min Lin' in GoogleThis author has not been identified. Look up 'Ren-Shin Cheng' in GoogleThis author has not been identified. Look up 'Chau-Jie Zhan' in GoogleThis author has not been identified. Look up 'Peng-Shu Chen' in GoogleThis author has not been identified. Look up 'Chang-Chih Liu' in GoogleThis author has not been identified. Look up 'Chao-Kai Hsu' in GoogleThis author has not been identified. Look up 'Hsiang-Hung Chang' in GoogleThis author has not been identified. Look up 'Huan-Chun Fu' in GoogleThis author has not been identified. Look up 'Yuan-Chang Lee' in GoogleThis author has not been identified. Look up 'Wen-Wei Shen' in GoogleThis author has not been identified. Look up 'Cheng-Ta Ko' in GoogleThis author has not been identified. Look up 'Wei-Chung Lo' in GoogleThis author has not been identified. Look up 'Yung Jean Lu' in Google

runs on WebDSL