Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth

Yung-Chuan Chiou, Yi-Ming Jen, Shih-Hsiang Huang. Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth. Microelectronics Reliability, 51(12):2319-2329, 2011. [doi]

Abstract

Abstract is missing.