Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects

Y. W. Chiu, Y. C. Chan, S. M. Lui. Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectronics Reliability, 42(12):1945-1951, 2002. [doi]

@article{ChiuCL02,
  title = {Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects},
  author = {Y. W. Chiu and Y. C. Chan and S. M. Lui},
  year = {2002},
  doi = {10.1016/S0026-2714(02)00097-5},
  url = {http://dx.doi.org/10.1016/S0026-2714(02)00097-5},
  tags = {C++},
  researchr = {https://researchr.org/publication/ChiuCL02},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {42},
  number = {12},
  pages = {1945-1951},
}