Numerical analysis of bonding process-induced deformation for 3D package - researchr publication authors

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Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim. Numerical analysis of bonding process-induced deformation for 3D package. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

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