Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim. Numerical analysis of bonding process-induced deformation for 3D package. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
@inproceedings{ChoaLK11,
title = {Numerical analysis of bonding process-induced deformation for 3D package},
author = {Sung-Hoon Choa and Haeng-Soo Lee and Kyoung-Ho Kim},
year = {2011},
doi = {10.1109/3DIC.2012.6263000},
url = {http://dx.doi.org/10.1109/3DIC.2012.6263000},
researchr = {https://researchr.org/publication/ChoaLK11},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}